Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919541 | Apparatus for preventing rapid temperature variation during wafer processing | — | 2005-07-19 |
| 6867120 | Method of fabricating a semiconductor device with a gold conductive layer and organic insulating layer | Takehiko Okajima | 2005-03-15 |
| 6440846 | Method for forming semiconductor device | — | 2002-08-27 |
| 6423559 | Integrated circuit and fabricating method and evaluating method of integrated circuit | Kazuyuki Inokuchi | 2002-07-23 |
| 6413888 | Method and apparatus for preventing rapid temperature variation of wafers during processing | — | 2002-07-02 |
| 6251696 | Method of forming integrated circuit with evaluation contacts electrically connected by forming via holes through the chip, and bonding the chip with a substrate | Kazuyuki Inokuchi | 2001-06-26 |
| 5994716 | Integrated circuit and fabricating method and evaluating method of integrated circuit | Kazuyuki Inokuchi | 1999-11-30 |
| 5412236 | Compound semiconductor device and method of making it | Tadashi Saito, Kazuyuki Inokuchi | 1995-05-02 |