Hidekazu Chiba

OC Oki Electric Industry Co.: 2 patents #947 of 2,807Top 35%

📍 Rifu, JP: #1,001 of 2,101 inventorsTop 50%

Overall (All Time): #2,211,283 of 4,157,543Top 55%

Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
6357650	Method of wire-bonding between pad on semiconductor chip and pad on circuit board on which the semiconductor chip is mounted	—	2002-03-19
6173879	Wire bonder	—	2001-01-16