YI

Yoshio Itabashi

OC Ohi Seisakusho Co.: 1 patents #94 of 196Top 50%
📍 Ibaraki, JP: #4,343 of 6,779 inventorsTop 65%
Overall (All Time): #3,377,131 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7172469 Structure of bonding plastic part insert-molded with wiring board and method of bonding the same Haruo Mochida, Shingo Goto, Masakazu Akahori, Katsumi Uraguchi, Tsugio Nakata 2007-02-06