Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6101700 | Method for manufacturing laminated part using a die contained sensing probe | William Burdett, Samuel A. Rummel | 2000-08-15 |
| 5196378 | Method of fabricating an integrated circuit having active regions near a die edge | Kenneth E. Bean, Jack W. Freeman, Robert Daniel McGrath | 1993-03-23 |