Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727168 | Inter-connection of a lead frame with a passive component intermediate structure | Bodin Kasemset, Krassavan Tantirittisak | 2020-07-28 |
| 8884415 | IC package with stainless steel leadframe | Bodin Kasemset, Ernst Eiper, Christian Zenz | 2014-11-11 |