Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8362618 | Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis | Ahmed Busnaina, Mehmet Remzi Dokmeci, Nishant Khanduja, Xugang Xiong, Prashanth Makaram +1 more | 2013-01-29 |