CC

Chung Chan

Northwestern University: 12 patents #72 of 3,846Top 2%
SG Silicon Genesis: 10 patents #7 of 40Top 20%
S( Silicon China (Hk): 5 patents #1 of 5Top 20%
NS Neah Power Systems: 4 patents #3 of 18Top 20%
AM Amazon: 1 patents #10,608 of 19,158Top 60%
SG Silicon General: 1 patents #3 of 10Top 30%
📍 Kowloon, MA: #1 of 8 inventorsTop 15%
Overall (All Time): #86,364 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 26–38 of 38 patents

Patent #TitleCo-InventorsDate
5883016 Apparatus and method for hydrogenating polysilicon thin film transistors by plasma immersion ion implantation Shu Qin 1999-03-16
5660570 Micro emitter based low contact force interconnection device Keith Warner, George B. Cvijanovich 1997-08-26
5653811 System for the plasma treatment of large area substrates 1997-08-05
5580429 Method for the deposition and modification of thin films using a combination of vacuum arcs and plasma immersion ion implantation Ryne C. Allen, Imad Husein, Yaunzhong Zhou 1996-12-03
5508227 Plasma ion implantation hydrogenation process utilizing voltage pulse applied to substrate Shu Qin 1996-04-16
5449920 Large area ion implantation process and apparatus 1995-09-12
5442185 Large area ion implantation process and apparatus 1995-08-15
5441624 Triggered vacuum anodic arc Ryne C. Allen, Zhong-Yi Xia 1995-08-15
5441617 Anodic arc source containment mechanisms Ryne C. Allen 1995-08-15
5302271 Anodic vacuum arc deposition system Steven Meassick 1994-04-12
5245248 Micro-emitter-based low-contact-force interconnection device Keith Warner, George B. Cvijanovich 1993-09-14
5220725 Micro-emitter-based low-contact-force interconnection device Keith Warner, George B. Cyijanovich 1993-06-22
5126163 Method for metal ion implantation using multiple pulsed arcs 1992-06-30