Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8579502 | Method for determining leak rate through a bond line of a MEMS device | Henry C. Abbink, Howard H. Ge, Daryl K. Sakaida | 2013-11-12 |
| 8007166 | Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in MEMS accelerometers | Henry C. Abbink, Howard H. Ge, Daryl K. Sakaida | 2011-08-30 |