Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4706382 | Assembly for packaging microcircuits having gold plated grounding and insulating leads, and method | Albert V. Suppinger | 1987-11-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4706382 | Assembly for packaging microcircuits having gold plated grounding and insulating leads, and method | Albert V. Suppinger | 1987-11-17 |