Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6225193 | Method of cleaving a semiconductor wafer including implanting and annealing resulting in exfoliation | Todd William Simpson, Grantley O. Este, Frank R. Shepherd | 2001-05-01 |
| 6197697 | Method of patterning semiconductor materials and other brittle materials | Todd William Simpson, Grantley O. Este, Frank R. Shepherd | 2001-03-06 |