Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6022583 | Method of encapsulating a wire bonded die | Frank Falcone, John Newbold | 2000-02-08 |
| D420099 | Fitting for a valve switch | John Newbold | 2000-02-01 |
| 5992688 | Dispensing method for epoxy encapsulation of integrated circuits | Eric Austin, Alec Babiarz, John Newbold | 1999-11-30 |
| 5927560 | Dispensing pump for epoxy encapsulation of integrated circuits | Eric Austin, Alec Babiarz, John Newbold | 1999-07-27 |
| 5906682 | Flip chip underfill system and method | Carlos E. Bouras, Duong La, Andre Gamelin, Mark S. Meier, Alec Babiarz | 1999-05-25 |