Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12403637 | Molding die for molding an endless-shaped gasket made of an elastic material along a surface of a plate-like base material | Bunpei Yoshida | 2025-09-02 |
| 10717219 | Molding method and molding die for molded article | Bunpei Yoshida, Takeshi Masaka, Shigeru Watanabe | 2020-07-21 |
| 5645937 | Thin film layered member | Shoji Noda, Kiyoshi Uchida, Akio Itoh, Kazuo Higuchi, Mikio Niimi +1 more | 1997-07-08 |
| 4447352 | Humidity sensitive element | Haruhiko Inoue, Masataka Naito | 1984-05-08 |