Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10214654 | Method for forming multilayer coating film | Tomomichi Shishaku, Hirokazu Togai | 2019-02-26 |
| 10149379 | Multi-layered circuit board and semiconductor device | Seisei Oyamada, Masamitsu Yoshizawa | 2018-12-04 |
| 9153549 | Semiconductor device | Seisei Oyamada, Masamitsu Yoshizawa | 2015-10-06 |
| 6583849 | Apparatus for exposure of photo-curing resin applied to printed circuit board | Masanori Noda | 2003-06-24 |
| 6276599 | Method and apparatus for forming solder bumps | — | 2001-08-21 |
| 6165544 | Method of exposure of photo-curing resin applied to printed circuit board | Masanori Noda | 2000-12-26 |