Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6010782 | Thin adhesive sheet for working semiconductor wafers | Gosei Uemura, Yoshinari Satoda | 2000-01-04 |
| 5714029 | Process for working a semiconductor wafer | Gosei Uemura, Yoshinari Satoda | 1998-02-03 |
| 5637395 | Thin adhesive sheet for working semiconductor wafers | Gosei Uemura, Yoshinari Satoda | 1997-06-10 |
| 5254201 | Method of stripping off wafer-protective sheet | Yukari Konda, Yutaka Kuwabara, Shoji Yamamoto, Tatuya Kubozono | 1993-10-19 |