Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10858552 | Masking pressure-sensitive adhesive tape | — | 2020-12-08 |
| 8827609 | Spindle device for machine tool | Kazunari Ogura, Nobumitsu Hori, Kunimichi Nakashima, Takamasa Shibata | 2014-09-09 |
| 8740523 | Spindle device | Kunimichi Nakashima, Takamasa Shibata, Takahito Umeki | 2014-06-03 |
| 8206068 | Main spindle device | Toshiharu Takashima | 2012-06-26 |
| 7997838 | Main spindle device | Toshiharu Takashima | 2011-08-16 |
| 7767556 | Adhesive sheet for laser dicing and its manufacturing method | — | 2010-08-03 |
| 7564119 | Adhesive sheet for laser dicing and its manufacturing method | — | 2009-07-21 |
| 7217638 | Wafer back surface treating method and dicing sheet adhering apparatus | — | 2007-05-15 |
| 7091499 | Ultraviolet irradiating method and an apparatus using the same | — | 2006-08-15 |
| 6656662 | Method of forming a polymer molecule chain | Masakazu Aono | 2003-12-02 |
| 6126772 | Method for resist removal, and adhesive or adhesive sheet for use in the same | Takayuki Yamamoto, Tatsuya Kubozono, Yasuo Kihara, Koichi Hashimoto, Takeshi Matsumura +3 more | 2000-10-03 |
| 5759874 | Method for producing semiconductor element and adhesive sheet for adhering wafer | — | 1998-06-02 |