TK

Tomoyuki Kasagi

ND Nitto Denko: 15 patents #204 of 2,479Top 9%
NS Nitto Shinko: 1 patents #18 of 39Top 50%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
Overall (All Time): #305,728 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12402260 Ventilation component Youzou Yano, Takumi Takahashi 2025-08-26
12342480 Ventilation assembly and ventilation housing Daisuke Kitagawa, Yusuke Nakayama, Akira Miyagaki, Teppei Tezuka, Youzou Yano 2025-06-24
12232282 Ventilation housing Daisuke Kitagawa, Youzou Yano 2025-02-18
12144130 Ventilation component Youzou Yano 2024-11-12
11963317 Ventilation assembly and ventilation housing Daisuke Kitagawa, Youzou Yano 2024-04-16
11884796 Plate-like composite material containing polytetrafluoroethylene and filler Shimpei Yakuwa, Kou Uemura, Shunji Imamura, Tao Gu 2024-01-30
11739853 Ventilation component Yusuke Nakayama, Youzou Yano, Akira Miyagaki 2023-08-29
11554350 Infernal pressure adjustment member and electrical component for transport equipment Kou Uemura, Teppei Tezuka, Satoshi Nishiyama 2023-01-17
11525567 Ventilation housing Daisuke Kitagawa, Satoshi Nishiyama, Youzou Yano 2022-12-13
11472165 Plate-like composite material Shunji Imamura, Shimpei Yakuwa, Kou Uemura, Yuya Kitagawa 2022-10-18
11453762 Plate-like composite material containing polytetrafluoroethylene and filler Shimpei Yakuwa, Kou Uemura, Shunji Imamura, Tao Gu 2022-09-27
11439958 Porous polytetrafluoroethylene membrane, and waterproof air-permeable membrane and waterproof air-permeable member including the same Teppei Tezuka, Youzou Yano, Kazuhiro Omura 2022-09-13
11376554 Porous polytetrafluoroethylene membrane, and waterproof air-permeable membrane and waterproof air-permeable member including the same Teppei Tezuka, Youzou Yano, Kazuhiro Omura 2022-07-05
11331876 Electrically insulating resin composition and laminate sheet Yasuyuki Kihara, Akira Tamai, Hiroichi Ukei, Mizuki Yamamoto 2022-05-17
10388425 Insulating resin material, metal layer-equipped insulating resin material using same, and wiring substrate Kou Uemura, Syunji Imamura, Yuya Kitagawa 2019-08-20