Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6284565 | Method of resin-encapsulating semiconductor chip and mold-releasing film used for the method | Toshimitsu Tachibana, Kenji Sato | 2001-09-04 |
| 6270879 | Release member for use in producing a multi-layer printed wiring board | Toshimitsu Tachibana, Kenji Sato | 2001-08-07 |