Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6538209 | Substrate for mounting semiconductor element having circuit patterns, and an insulating layer made of photosensitive and thermally-melting type adhesive resin | Kazuo Ouchi | 2003-03-25 |
| 6379159 | Interposer for chip size package and method for manufacturing the same | Kazuo Ouchi, Satoshi Tanigawa, Hirofumi Fujii | 2002-04-30 |