KU

Kazuki Uwada

ND Nitto Denko: 13 patents #245 of 2,479Top 10%
MC Mitsubishi Chemical: 1 patents #1,511 of 3,022Top 50%
Overall (All Time): #371,972 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11618807 Film with void spaces bonded through catalysis and method of producing the same Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto, Nao Murakami 2023-04-04
10815355 Silicone porous body and method of producing the same Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori 2020-10-27
10634836 Circular polarizer for organic EL display device having laminated half wavelength plate and quarter wavelength plate, and organic EL display device Kentarou Takeda, Hironori Yaginuma, Tadashi Kojima, Nao Murakami 2020-04-28
10472483 Silicone porous body and method of producing the same Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori 2019-11-12
9627655 Display device and method for manufacturing same Hironori Yaginuma, Kentarou Takeda, Takashi Shimizu, Nao Murakami 2017-04-18
9459389 Polarizing plate and organic EL panel Takashi Shimizu, Nao Murakami, Tadashi Kojima, Hironori Yaginuma 2016-10-04
9453951 Retardation film web, circularly polarizing plate and organic EL panel Takashi Shimizu, Tadashi Kojima, Nao Murakami, Tomohiko Tanaka, Shingo Namiki 2016-09-27
9400345 Circular polarizing plate and organic electroluminescence panel Toshiyuki Iida, Takashi Shimizu, Nao Murakami, Tadashi Kojima 2016-07-26
9164213 Polarizing plate and organic EL panel Hironori Yaginuma, Takashi Shimizu, Nao Murakami, Tadashi Kojima, Kentarou Takeda 2015-10-20
8269928 Polarizing plate, liquid crystal panel, and liquid crystal display Masatsugu Higashi, Takashi Kumano, Nao Murakami 2012-09-18
7018718 Adhesive film for underfill and semiconductor device using the same Akiko Matsumura, Naoki Sadayori, Yuji Hotta 2006-03-28
6978079 Optical semiconductor device Yuji Hotta, Noriaki Harada 2005-12-20
6846550 Adhesive film for underfill and semiconductor device using the same Akiko Matsumura, Naoki Sadayori, Yuji Hotta 2005-01-25