AH

Atsushi Hino

ND Nitto Denko: 27 patents #70 of 2,479Top 3%
MC Menicon Co.: 1 patents #139 of 263Top 55%
NC Nitto Electric Industrial Co.: 1 patents #106 of 298Top 40%
📍 Ibaraki, JP: #227 of 6,779 inventorsTop 4%
Overall (All Time): #138,927 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
9657198 Impact-absorbing pressure-sensitive adhesive sheet and method of producing the same Tomonori Noguchi, Kanji Nishida, Kazuo Kitada, Takaichi Amano 2017-05-23
9566663 Laser processing method and land laser processed product Kanji Nishida, Naoyuki Matsuo 2017-02-14
8846197 Impact-absorbing pressure-sensitive adhesive sheet and method of producing the same Tomonori Noguchi, Kanji Nishida, Kazuo Kitada, Takaichi Amano 2014-09-30
8778118 Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same Masakatsu Urairi, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto 2014-07-15
8624156 Manufacturing method of laser processed parts and protective sheet for laser processing Naoyuki Matsuo, Masakatsu Urairi 2014-01-07
8168030 Manufacturing method of laser processed parts and adhesive sheet for laser processing Naoyuki Matsuo, Masakatsu Urairi 2012-05-01
7922843 Method and system for laminating optical elements Kazuo Kitada, Yoshihiro Kameda, Kanji Nishida, Tomokazu Yura, Takaichi Amano +2 more 2011-04-12
7913734 Method and system for laminating optical elements Kazuo Kitada, Yoshihiro Kameda, Kanji Nishida, Tomokazu Yura, Takaichi Amano +2 more 2011-03-29
7858543 Resin joined body Naoyuki Matsuo, Masayuki Kaneto 2010-12-28
7586060 Protective sheet for laser processing and manufacturing method of laser processed parts Masakatsu Urairi, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto 2009-09-08
7085469 Process for producing three-dimensional polyimide optical waveguide Kazunori Mune, Ryuusuke Naitou, Amane Mochizuki, Mika Horiike 2006-08-01
6642478 Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board Kanji Nishida, Hitoshi Ishizaka 2003-11-04
6373709 Flexible wiring board Hitoshi Ishizaka 2002-04-16
6222272 Film carrier and semiconductor device using same Yoshinari Takayama, Kazuo Ouchi 2001-04-24
6168910 Method for removing residue and method for production of printed board having hole Hitoshi Ishizaka 2001-01-02
6157084 Film carrier and semiconductor device using same Toshiki Naito, Masakazu Sugimoto 2000-12-05
6037103 Method for forming hole in printed board 2000-03-14
5977783 Multilayer probe for measuring electrical characteristics Yoshinari Takayama, Toshikazu Baba, Ichiro Amino 1999-11-02
5877559 Film carrier for fine-pitched and high density mounting and semiconductor device using same Yoshinari Takayama, Kazuo Ouchi 1999-03-02
5848465 Method for fabrication of probe Shoji Morita, Masakazu Sugimoto 1998-12-15
5821626 Film carrier, semiconductor device using same and method for mounting semiconductor element Kazuo Ouchi, Shoji Morita, Masakazu Sugimoto 1998-10-13
5691210 Method for fabrication of probe structure and circuit substrate therefor Yoshihisa Mori, Hitoshi Ishizaka 1997-11-25
5374469 Flexible printed substrate Amane Mochizuki, Kazuo Ouchi, Shoji Morita, Toshiki Naito, Kazumi Higashi +4 more 1994-12-20
5188702 Process for producing an anisotropic conductive film Yoshinari Takayama, Amane Mochizuki, Kazuo Ouchi, Masakazu Sugimoto 1993-02-23
5136359 Anisotropic conductive film with through-holes filled with metallic material Yoshinari Takayama, Amane Mochizuki, Kazuo Ouchi, Masakazu Sugimoto 1992-08-04