Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12012501 | Resin composition for acoustic matching layer | Takashi Suzuki, Yoshitaka Saito, Nana Isomoto | 2024-06-18 |
| 10997961 | Acoustic lens and production method thereof, and acoustic wave probe | Takashi Suzuki, Shigeo Kobayashi | 2021-05-04 |
| 7253246 | Thermosetting polycarbodiimide copolymer | Ikuo Takahashi | 2007-08-07 |
| 6979703 | Acoustically matching layer and composition thereof | Ikuo Takahashi | 2005-12-27 |
| 6818097 | Highly heat-resistant plasma etching electrode and dry etching device including the same | Akira Yamaguchi | 2004-11-16 |
| 6524711 | Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition | Yasuo Imashiro, Takahiko Ito, Norimasa Nakamura | 2003-02-25 |
| 6486266 | Thermosetting resin composition | Satoshi Amano | 2002-11-26 |
| 6485833 | Resin-coated metal foil | Yasuo Imashiro, Takahiko Ito, Norimasa Nakamura | 2002-11-26 |
| 6440258 | Adhesive film for semiconductor package | Yasuo Imashiro, Takahiko Ito, Norimasa Nakamura | 2002-08-27 |
| 6387505 | Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board | Yasuo Imashiro, Takahiko Ito, Norimasa Nakamura | 2002-05-14 |
| 6333101 | Method of adhering adherends | Yasuo Imashiro, Kazuo Saito, Satoshi Amano, Takahiko Itoh, Ikuo Takahashi | 2001-12-25 |
| 6331226 | LCP bonding method | Yasuo Imashiro, Takahiko Itoh, Norimasa Nakamura | 2001-12-18 |
| 6310119 | Film-shaped encapsulating agent for electronic parts | Yasuo Imashiro, Takahiko Ito, Norimasa Nakamura | 2001-10-30 |
| 6300425 | Thermosetting resin composition | Satoshi Amano | 2001-10-09 |
| 6225417 | One-pack type epoxy resin composition | Yasuo Imashiro, Takahiko Ito, Norimasa Nakamura | 2001-05-01 |
| 6172143 | Resin composition for use in sealant and liquid sealant using the resin composition | Satoshi Amano | 2001-01-09 |
| 6140454 | Adhesive resin composition and sealing resin composition | Satoshi Amano | 2000-10-31 |
| 6103836 | Epoxy resin composition | Yasuo Imashiro, Takahiko Ito, Norimasa Nakamura | 2000-08-15 |
| 5679730 | Epoxy resin composition and epoxy resin-based adhesive | Satoshi Amano | 1997-10-21 |
| 5650476 | Process for production of polycarbodiimide resin powder | Satoshi Amano, Tomoki Nakamura, Takahiko Ito, Norimasa Nakamura | 1997-07-22 |