Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10615868 | Communication system and fault detection method | Tetsuro Inui, Akira Hirano, Wataru Imajuku, Shoukei Kobayashi, Takafumi Tanaka +2 more | 2020-04-07 |
| 10585691 | Distribution system, computer, and arrangement method for virtual machine | Yohsuke Ishii, Hiromu Hota, Nobuaki Kohinata | 2020-03-10 |
| 10527781 | Communication system and connector | Tetsuro Inui, Akira Hirano, Wataru Imajuku, Shoukei Kobayashi, Takafumi Tanaka +2 more | 2020-01-07 |
| 10511381 | Communication system and fault location specifying method | Tetsuro Inui, Akira Hirano, Wataru Imajuku, Shoukei Kobayashi, Takafumi Tanaka +2 more | 2019-12-17 |
| 10459893 | Computer system, file storage apparatus, and storage control method | Kazuhito Yokoi, Go Kojima, Yasushi Miyata, Masanori Takata, Hitoshi Kamei +1 more | 2019-10-29 |
| 10422953 | Optical module and inputting method | Akira Oka | 2019-09-24 |
| 10164847 | Data transfer monitor system, data transfer monitor method and base system | Hiroyasu Nishiyama | 2018-12-25 |
| 9933822 | Electronic component case and electronic component device | Minshong Tan, Syuzo Aoki | 2018-04-03 |
| 9920232 | Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component | Syuzo Aoki, Takuya Kurosawa, Shoji Koizumi, Hidekazu Takizawa, Yutaka Komatsu +1 more | 2018-03-20 |
| 9873825 | Carbon nanotube sheet, semiconductor device, method of manufacturing carbon nanotube sheet, and method of manufacturing semiconductor device | — | 2018-01-23 |
| 9332659 | Electronic component case and electronic component device | Minshong Tan, Syuzo Aoki | 2016-05-03 |
| 9319284 | Operation delay monitoring method, operation management apparatus, and operation management program | Daisuke Iizuka | 2016-04-19 |
| 9264337 | Service monitoring system, service monitoring method, and non-transitory computer-readable recording medium | Daisuke Iizuka | 2016-02-16 |
| 9101981 | Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component | Syuzo Aoki, Takuya Kurosawa, Shoji Koizumi, Hidekazu Takizawa, Yutaka Komatsu +1 more | 2015-08-11 |
| 8350263 | Semiconductor package, method of evaluating same, and method of manufacturing same | — | 2013-01-08 |
| 8130500 | Thermal conductive member, manufacturing method of the thermal conductive member, heat radiating component, and semiconductor package | — | 2012-03-06 |
| 8127439 | Method of manufacturing electronic component device | — | 2012-03-06 |
| 8073938 | Information processing apparatus and method of operating the same | Daisuke Iizuka | 2011-12-06 |
| 7768122 | Semiconductor package | — | 2010-08-03 |
| 7090413 | Optical semiconductor device | Toshihisa Yoda | 2006-08-15 |