Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9881861 | Wiring substrate | — | 2018-01-30 |
| 9349674 | Wiring board unit, manufacturing method thereof, and manufacturing method of wiring board with lead | Kensuke Matsuhashi | 2016-05-24 |
| 9018755 | Joint structure and semiconductor device storage package | Naoki Tsuda | 2015-04-28 |
| 5759647 | Tubular article method for injection molding thereof | Rikio Kuroda, Akio Hashimoto | 1998-06-02 |
| 5218037 | Thermoplastic resin composition and method for preparing the same | Yuichi Orikasa, Suehiro Sakazume, Yoshinori Maki | 1993-06-08 |
| 4983663 | Thermoplastic resin composition and method for preparing the same | Yuichi Orikasa, Suehiro Sakazume, Yoshinori Maki | 1991-01-08 |
| 4962148 | Thermoplastic resin composition and method for preparing the same | Yuichi Orikasa, Suehiro Sakazume, Yoshinori Maki | 1990-10-09 |
| 4599391 | Coating composition for power cable | Kaoru Yamamoto, Takashi Inoue, Shinji Kojima | 1986-07-08 |