MS

Mamoru Seio

NC Nippon Paint Holdings Co.: 12 patents #42 of 834Top 6%
Sharp Kabushiki Kaisha: 2 patents #5,184 of 10,731Top 50%
N( Napp Systems (Usa): 1 patents #5 of 11Top 50%
Overall (All Time): #327,737 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
6623812 Reflector, method for fabrication thereof and reflective liquid crystal display device incorporating the reflector Hideto Tanaka, Hiromasa Minamino, Hirokazu Kaji, Masashi Ohata 2003-09-23
6366333 Method of forming a conductive and reflective thin metal film suitable for a reflective LCD device and a device produced by the method Akira Yamamoto, Masashi Ohata 2002-04-02
5531881 Method for correcting defect in color filter Akira Matsumura, Masashi Ohata 1996-07-02
5474666 Method of treating an electrodeposited photosensitive resist to reduce water spotting Kazuyuki Suga, Kanji Nishijima 1995-12-12
5401604 Positive-type photosensitive resin compositions with quinone diazide sulfonyl unit Chikayuki Otsuka, Kiyomi Sakurai, Kazuyuki Kawamura 1995-03-28
5368884 Method of forming solder mask Yoshikazu Yamagami, Akio Kashihara, Hisaki Tanabe 1994-11-29
5232816 Positive type photosensitive resinous composition comprising a resin copolymer having at least a phosphoric acid ester monomer Takeshi Ikeda, Kiyomi Sakurai 1993-08-03
5166036 Electrodeposition coating composition and image-forming method using the same Takeshi Ikeda, Kanji Nishijima, Katsukiyo Ishikawa 1992-11-24
5055374 Electrodeposition coating composition containing an acrylic resin and a quinnone diazide group bearing resin Takeshi Ikeda, Kanji Nishijima, Katsukiyo Ishikawa 1991-10-08
4999274 Positive type photosensitive resinous composition with 1,2 quinone diazide sulfonyl unit Kanji Nishijima, Katsukiyo Ishikawa 1991-03-12
4952481 Photosensitive resin composition Hidefumi Kusuda, Masami Kawabata 1990-08-28
4946757 Positive type 1,2 quinone diazide containing photosensitive resinous composition with acrylic copolymer resin Kanji Nishijima, Katsukiyo Ishikawa 1990-08-07
RE33108 Method for preparing a printed circuit board Katsukiyo Ishikawa, Kanji Nishijima 1989-11-07
4673458 Method for preparing a printed circuit board Katsukiyo Ishikawa, Kanji Nishijima 1987-06-16
4671854 Method for preparing a printed circuit board with solder plated circuit and through-holes Katsukiyo Ishikawa, Kanji Nishijima 1987-06-09