Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856695 | Method for forming through-hole, and substrate for flexible printed wiring board | Toshihiro Higashira | 2023-12-26 |
| 11310917 | Method for manufacturing substrate for flexible printed wiring board, and substrate for flexible printed wiring board | Toshihiro Higashira | 2022-04-19 |