Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5950643 | Wafer processing system | Takeshiro Miyazaki, Yoshikazu Tsubata, Noboru Katsumata, Akihiro Nakayama, Toyokazu Harada +2 more | 1999-09-14 |
| 5865162 | Wire saw and work slicing method | Takashi Kambe, Yukihiro Kanemichi, Yasuhiro Itou, Shigeo Kobayashi | 1999-02-02 |
| D401249 | Roller for a wire saw for semiconductors | — | 1998-11-17 |