FY

Fan Yang

NL Ningde Amperex Technology Limited: 9 patents #19 of 328Top 6%
PU Princeton University: 7 patents #80 of 1,197Top 7%
University of Michigan: 5 patents #363 of 4,352Top 9%
TSMC: 3 patents #5,465 of 12,232Top 45%
CC China Petroleum & Chemical: 3 patents #330 of 1,719Top 20%
QU Qualcomm: 3 patents #4,487 of 12,104Top 40%
ST Southwest University Of Science And Technology: 3 patents #5 of 43Top 15%
University of California: 2 patents #4,561 of 18,278Top 25%
SE Sinopec Research Institute Of Petroleum Engineering: 2 patents #9 of 55Top 20%
HC Huizhou Tcl Mobile Communication Co.: 2 patents #81 of 355Top 25%
VS Valspar Sourcing: 2 patents #83 of 201Top 45%
UC University Of Southern California: 1 patents #782 of 1,826Top 45%
XA Xad: 1 patents #31 of 39Top 80%
XM Xiamen Institute Of Rare Earth Materials: 1 patents #6 of 25Top 25%
AT Anhui University Of Science And Technology: 1 patents #58 of 163Top 40%
SF SUNY Research Foundation: 1 patents #469 of 1,165Top 45%
BE Baotou Research Institute Of Rare Earths: 1 patents #12 of 86Top 15%
BT Beijing University Of Technology: 1 patents #182 of 570Top 35%
CO Conopco: 1 patents #949 of 1,903Top 50%
GI Giner: 1 patents #21 of 56Top 40%
MP Mediatek Singapore Pte.: 1 patents #350 of 734Top 50%
NC National Engineering Research Centre Of Ruike Rare Earth Metallurgy And Function Materials Co: 1 patents #12 of 60Top 20%
PP Plug Power: 1 patents #81 of 157Top 55%
SS Shanghai Institute Of Ceramics, Chinese Academy Of Sciences: 1 patents #30 of 130Top 25%
SU Shanghai Jiao Tong University: 1 patents #250 of 905Top 30%
UB University Of Maryland, Baltimore: 1 patents #465 of 1,115Top 45%
📍 Shanghai, NY: #11 of 128 inventorsTop 9%
Overall (All Time): #48,436 of 4,157,543Top 2%
53
Patents All Time

Issued Patents All Time

Showing 51–53 of 53 patents

Patent #TitleCo-InventorsDate
6423640 Headless CMP process for oxide planarization Tze-Liang Lee, Chen-Hwa Yu 2002-07-23
6350667 Method of improving pad metal adhesion Sheng-Hsiung Chen 2002-02-26
6340638 Method for forming a passivation layer on copper conductive elements Jong Chen, Tze-Liang Lee 2002-01-22