Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7199329 | Method of soldering semiconductor part and mounted structure of semiconductor part | Yukihiro Ueno, Hironori Urasawa, Yuki Oishi, Tadashi Miyazaki | 2007-04-03 |
| 6976616 | Circuit board transferring apparatus and method and solder ball mounting method | Yukihiro Ueno, Hironori Urasawa, Akihiro Tanaka | 2005-12-20 |