Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12377501 | Solder preform containing Cu—Co particles | — | 2025-08-05 |
| 12172242 | Lead-free solder alloy | Takatoshi Nishimura, Tetsuya Akaiwa | 2024-12-24 |
| 11980974 | Solder joint part and method for manufacturing the same | Kazuhiro Nogita, Stuart David McDonald, Shiqian Liu, Takatoshi Nishimura, Tetsuya Akaiwa | 2024-05-14 |
| 11839937 | Lead-free solder alloy and solder joint part | — | 2023-12-12 |
| 10966618 | Lifesaving assisting apparatus | Tomoyoshi NATSUI, Satoshi Hayashi, Tsutomu Wakabayashi, Taku Iwami, Toshihiro Hatakeyama +1 more | 2021-04-06 |
| 10427220 | Nanoparticle production method, production device and automatic production device | Teruo Komatsu | 2019-10-01 |
| 10329642 | Solder alloy and joint thereof | Shoichi Suenaga, Takashi Nozu, Motonori Miyaoka, Yasufumi Shibata | 2019-06-25 |
| 10286497 | Lead-free solder alloy | Takatoshi Nishimura | 2019-05-14 |
| 9999945 | Solder alloy | Kazuhiro Nogita, Stuart David McDonald, Jonathan James Read, Tina Ventura | 2018-06-19 |
| 9999936 | Solder wire bobbinless coil | Yutaka Fukushima, Hideki Yoshida | 2018-06-19 |
| 9339893 | Lead-free solder alloy | — | 2016-05-17 |
| 8999519 | Solder joint | — | 2015-04-07 |
| 8652269 | Flux composition and soldering paste composition | Mitsuhiro Kawahara, Masuml Asakawa, Toshimi Shimizu | 2014-02-18 |
| 8557021 | Method of regulating nickel concentration in lead-free solder containing nickel | — | 2013-10-15 |
| 8163061 | Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin | — | 2012-04-24 |
| 8147746 | Apparatus for precipitation/separation of excess copper in lead-free solder | — | 2012-04-03 |
| 7861909 | Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath | — | 2011-01-04 |
| 7591873 | Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin | — | 2009-09-22 |
| 6699306 | Control method for copper density in a solder dipping bath | Masuo Koshi, Kenichirou Todoroki | 2004-03-02 |
| 6296722 | Lead-free solder alloy | — | 2001-10-02 |
| 6044769 | In-pipe work apparatus | Kiyoshi Oka, Eisuke Tada, Tadashi Ogawa, Kouichi Tuji, Yuuji Takiguchi +4 more | 2000-04-04 |
| 5772101 | Wave soldering machine | Yasuo Seo | 1998-06-30 |
| 5487868 | Tin based solder alloy containing lead, antimony, and tellurium | — | 1996-01-30 |
| 5417771 | Soldering flux | Kazuhiro Arita | 1995-05-23 |
| 4915704 | Tube assembly with a breakaway plug | Eiichi Miyasaka, Kazuhiko SUDO | 1990-04-10 |