| 12125607 |
Metal powder sintering paste and method of producing the same, and method of producing conductive material |
Masafumi Kuramoto |
2024-10-22 |
| 11752551 |
Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module |
Masafumi Kuramoto |
2023-09-12 |
| 11739238 |
Electrically conductive adhesive and electrically conductive material |
Masafumi Kuramoto |
2023-08-29 |
| 11634596 |
Metal powder sintering paste and method of producing the same, and method of producing conductive material |
Masafumi Kuramoto |
2023-04-25 |
| 11162004 |
Electrically conductive adhesive and electrically conductive material |
Masafumi Kuramoto |
2021-11-02 |
| 10941304 |
Metal powder sintering paste and method of producing the same, and method of producing conductive material |
Masafumi Kuramoto |
2021-03-09 |
| 10875127 |
Method for bonding electronic component and method for manufacturing bonded body |
— |
2020-12-29 |
| 10707388 |
Semiconductor device, and method for manufacturing semiconductor device |
Masafumi Kuramoto |
2020-07-07 |
| 10593851 |
Metal powder sintering paste, method for producing the same, and method for producing conductive material |
Masafumi Kuramoto |
2020-03-17 |
| 8836130 |
Light emitting semiconductor element bonded to a base by a silver coating |
Masafumi Kuramoto, Satoru Ogawa |
2014-09-16 |