SS

Shimpei Sasaoka

Nichia: 42 patents #16 of 1,531Top 2%
SC Sh Materials Co.: 1 patents #2 of 13Top 20%
📍 Tokushima, JP: #27 of 1,059 inventorsTop 3%
Overall (All Time): #71,550 of 4,157,543Top 2%
42
Patents All Time

Issued Patents All Time

Showing 26–42 of 42 patents

Patent #TitleCo-InventorsDate
10050186 Light emitting device Takuya Nakabayashi 2018-08-14
9991432 Light emitting apparatus Takuya Nakabayashi 2018-06-05
9991237 Light emitting device Kazuto Okamoto 2018-06-05
9893255 Molded package and light emitting device Takuya Nakabayashi 2018-02-13
9812627 Light emitting device Ryohei Yamashita 2017-11-07
9647190 Package for light emitting apparatus and light emitting apparatus including the same Takuya Nakabayashi 2017-05-09
9583422 Lead frame Katsuyuki Doumae, Yoshio Ichihara 2017-02-28
9537071 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Hirofumi Ichikawa, Masaki Hayashi, Tomohide Miki 2017-01-03
9490411 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Hirofumi Ichikawa, Masaki Hayashi, Tomohide Miki 2016-11-08
9406856 Package for light emitting apparatus and light emitting apparatus including the same Takuya Nakabayashi 2016-08-02
9357641 Molded package and light emitting device Takuya Nakabayashi 2016-05-31
9287476 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Hirofumi Ichikawa, Masaki Hayashi, Tomohide Miki 2016-03-15
D736964 Light emitting diode Hironobu Takahashi 2015-08-18
D698047 Light emitting diode Hironobu Takahashi 2014-01-21
8530250 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Hirofumi Ichikawa, Masaki Hayashi, Tomohide Miki 2013-09-10
D664103 Light emitting diode Hironobu Takahashi 2012-07-24
7915090 Method for manufacturing a semiconductor device Hiroki Takahashi 2011-03-29