Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11864317 | Sn—Bi and copper powder conductive paste in through hole of insulating substrate | Masaaki Katsumata, Koji Taguchi, Yosuke Noda | 2024-01-02 |
| 10887988 | Circuit substrate, component-mounted substrate, and methods of manufacturing circuit substrate and component-mounted substrate | Masaaki Katsumata, Koji Taguchi, Yosuke Noda | 2021-01-05 |