Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769852 | Method of cutting a substrate along dividing lines | Minoru Yamamoto, Naoto Inoue, Hiroaki TAMEMOTO | 2023-09-26 |
| 10672660 | Method of manufacturing semiconductor element | Naoto Inoue, Sho Kusaka, Minoru Yamamoto, Hiroaki TAMEMOTO | 2020-06-02 |
| 7534282 | High purity metal Mo coarse powder and sintered sputtering target produced by thereof | Kenji Iwamoto | 2009-05-19 |