Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046705 | Method of manufacturing light source device having a bonding layer with bumps and a bonding member | Takashi Matsumoto, Naoki Harada, Yoshiyuki Kageyama | 2024-07-23 |
| 11677062 | Method of manufacturing light source device having a bonding layer with bumps and a bonding member | Takashi Matsumoto, Naoki Harada, Yoshiyuki Kageyama | 2023-06-13 |