Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119434 | Light emitting device including first reflecting layer and second reflecting layer | Kenji OZEKI, Atsushi Kojima | 2024-10-15 |
| 12080835 | Light emitting device and method of manufacturing light emitting device | Kenji OZEKI, Atsushi Kojima | 2024-09-03 |
| 11996502 | Method of manufacturing light-emitting device including step of curing sealing member while applying centrifugal force | Kenji OZEKI, Atsushi Kojima | 2024-05-28 |
| 11791448 | Light-emitting device and element mounting wiring board | Atsushi Kojima, Kenji OZEKI | 2023-10-17 |
| 11764342 | Light emitting device and method for manufacturing light emitting device | Kenji OZEKI, Atsushi Kojima | 2023-09-19 |
| 11757078 | Light emitting device including first reflecting layer and second reflecting layer | Kenji OZEKI, Atsushi Kojima | 2023-09-12 |
| 11616179 | Light emitting device and method of manufacturing light emitting device | Kenji OZEKI, Atsushi Kojima | 2023-03-28 |
| 11362248 | Method of manufacturing light-emitting device, light-emitting device, element mounting wiring board | Atsushi Kojima, Kenji OZEKI | 2022-06-14 |
| 11189765 | Light emitting device and method of manufacturing light emitting device | Kenji OZEKI, Atsushi Kojima | 2021-11-30 |
| 11171260 | Light-emitting device and method for manufacturing light-emitting device | Kenji OZEKI, Atsushi Kojima, Yoshio Ichihara | 2021-11-09 |
| 11164991 | Light emitting device and method for manufacturing light emitting device | Kenji OZEKI, Atsushi Kojima | 2021-11-02 |
| 11121297 | Method of manufacturing light emitting device that includes a first reflecting layer and a second reflecting layer | Kenji OZEKI, Atsushi Kojima | 2021-09-14 |
| 11043621 | Light emitting device and method of manufacturing light emitting device | Masato Aihara, Kenji OZEKI, Atsushi Kojima, Kazuya Tamura | 2021-06-22 |
| 10910515 | Method of manufacturing a light-emitting device | Kenji OZEKI | 2021-02-02 |