Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7438969 | Filling material, multilayer wiring board, and process of producing multilayer wiring board | Toshifumi Kojima, Makoto Wakazono | 2008-10-21 |
TT
Toshikatu Takada
Overall (All Time): #3,367,964 of 4,157,543Top 85%
1
Patents All Time