Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8674236 | Wiring substrate and method of manufacturing the same | Kazunaga Higo, Hidemasa Igarashi, Masatsune Arakawa, Erina Yamada, Kenji Suzuki +2 more | 2014-03-18 |
| 8450622 | Multilayer wiring substrate and method of manufacturing the same | Shinnosuke MAEDA, Tetsuo Suzuki, Satoshi Hirano | 2013-05-28 |
| 8387241 | Method of fabricating wiring board | Masaki Muramatsu, Kenji Nishio, Kazunaga Higo, Hironori Sato, Masao Izumi | 2013-03-05 |