Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6333857 | Printing wiring board, core substrate, and method for fabricating the core substrate | Yukihiro Kimura, Kouki Ogawa | 2001-12-25 |
| 6214445 | Printed wiring board, core substrate, and method for fabricating the core substrate | Yukihiro Kimura, Kouki Ogawa | 2001-04-10 |
| 5721453 | Integrated circuit package | Ryuji Imai | 1998-02-24 |
| 5468997 | Integrated circuit package having a multilayered wiring portion formed on an insulating substrate | Ryuji Imai | 1995-11-21 |
| 5250244 | Method of producing sintered ceramic body | Yukihiro Kimura, Sumihito Tominaga | 1993-10-05 |
| 5093186 | Multilayer ceramic wiring board | Yukihiro Kimura, Nobuhiko Miyawaki, Sumihito Tominaga | 1992-03-03 |
| 4532190 | Metal-ceramics composite materials | Kazuo Kimura | 1985-07-30 |