Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5484963 | Ceramic substrate provided with metallized layers for connection with chip, circuit board, or the like | — | 1996-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5484963 | Ceramic substrate provided with metallized layers for connection with chip, circuit board, or the like | — | 1996-01-16 |