Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5635301 | Multilayered glass substrate | Kazuo Kondo | 1997-06-03 |
| 5405562 | Process of making a coated substrate having closed porosity | Kazuo Kondo | 1995-04-11 |
| 5352482 | Process for making a high heat-conductive, thick film multi-layered circuit board | Kazuo Kondo | 1994-10-04 |
| 5318744 | Process for producing ceramic sintered body having metallized via hole | Kazuo Kondo | 1994-06-07 |
| 5261950 | Composition for metalizing ceramics | Kazunori Miura, Kazuo Kondo | 1993-11-16 |
| 5175130 | Low-temperature baked substrate | Kazuo Kondo | 1992-12-29 |
| 5122930 | High heat-conductive, thick film multi-layered circuit board | Kazuo Kondo | 1992-06-16 |
| 5120473 | Metallizing composition for use with ceramics | Kazuo Kondo | 1992-06-09 |
| 5011734 | Ceramic substrate | Kazuo Kondo | 1991-04-30 |
| 5011530 | Metallizing composition for use with ceramics | Kazuo Kondo | 1991-04-30 |
| 5006167 | Metallizing composition | Kazuo Kondo | 1991-04-09 |
| 5003131 | Connection structure between ceramic body and outer terminal | Kazuo Kondo | 1991-03-26 |
| 4963187 | Metallizing paste for circuit board having low thermal expansion coefficient | Kazuo Kondo | 1990-10-16 |
| 4943470 | Ceramic substrate for electrical devices | Hisaharu Shiromizu, Tsuneyuki Sukegawa, Kazuo Kondo | 1990-07-24 |
| 4941582 | Hermetically sealed ceramic package | Kazuo Kondo | 1990-07-17 |
| 4871608 | High-density wiring multilayered substrate | Kazuo Kondo, Hiroshi Iwata, Yoshimasa Shibata | 1989-10-03 |
| 4837408 | High density multilayer wiring board and the manufacturing thereof | Kazuo Kondo, Hiroshi Iwata | 1989-06-06 |
| 4810528 | Process for producing multilayer circuit board | Kazuo Kondo, Hisaharu Shiromizu, Tsuneyuki Sukegawa | 1989-03-07 |
| 4801067 | Method of connecting metal conductor to ceramic substrate | Kazuo Kondo, Tsuneyuki Sukegawa | 1989-01-31 |