Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784182 | Bonded substrate and method for manufacturing bonded substrate | Makoto Tani, Takeshi Kaku, Takashi Ebigase | 2020-09-22 |
| 10392310 | Porous plate-shaped filler aggregate, producing method therefor, and heat-insulation film containing porous plate-shaped filler aggregate | Akinobu Oribe, Hiroharu Kobayashi, Takahiro Tomita, Shinsaku Maeda | 2019-08-27 |