Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12239022 | Assembly of piezoelectric material substrate and supporting substrate | Yuji Hori, Takahiro Yamadera | 2025-02-25 |
| 11871671 | Assembly of piezoelectric material substrate and supporting substrate, and method for manufacturing same | Yuji Hori, Takahiro Yamadera | 2024-01-09 |
| 11700771 | Assembly of piezoelectric material substrate and support substrate, and method for manufacturing said assembly | Yuji Hori, Takahiro Yamadera | 2023-07-11 |
| 11689172 | Assembly of piezoelectric material substrate and support substrate, and method for manufacturing said assembly | Yuji Hori, Takahiro Yamadera | 2023-06-27 |
| 11658635 | Joined body of piezoelectric material substrate and support substrate, and acoustic wave element | Yuji Hori, Takahiro Yamadera | 2023-05-23 |
| 11082025 | Joined body of piezoelectric material substrate and support substrate | Yuji Hori | 2021-08-03 |
| 11082026 | Joined body of piezoelectric material substrate and support substrate | Yuji Hori | 2021-08-03 |
| 11013127 | Method for producing connection substrate | Sugio Miyazawa, Akiyoshi Ide | 2021-05-18 |
| 10278286 | Connection substrate | Akiyoshi Ide, Sugio Miyazawa | 2019-04-30 |
| 10257941 | Connection substrate | Sugio Miyazawa, Akiyoshi Ide | 2019-04-09 |
| 10204838 | Handle substrate of composite substrate for semiconductor, and composite substrate for semiconductor | Akiyoshi Ide, Sugio Miyazawa, Yasunori Iwasaki | 2019-02-12 |
| 9894763 | Insulating substrates including through holes | Yasunori Iwasaki, Sugio Miyazawa, Akiyoshi Ide, Hirokazu Nakanishi | 2018-02-13 |
| 9812345 | Composite substrate, semiconductor device, and method for manufacturing semiconductor device | Akiyoshi Ide, Sugio Miyazawa, Yuji Hori, Tomoyoshi Tai, Ryosuke Hattori | 2017-11-07 |
| 9673282 | Handle substrates of composite substrates for semiconductors, and composite substrates for semiconductors | Sugio Miyazawa, Yasunori Iwasaki, Akiyoshi Ide, Hirokazu Nakanishi | 2017-06-06 |
| 9559090 | Silicon wafer with a plurality of chip patterns | — | 2017-01-31 |
| 9538653 | Insulating substrates including through holes | Yasunori Iwasaki, Sugio Miyazawa, Akiyoshi Ide, Hirokazu Nakanishi | 2017-01-03 |
| 9530954 | Piezoelectric element | Kazuyoshi Shibata, Haruhiko Ito | 2016-12-27 |
| 9425083 | Handle substrate, composite substrate for semiconductor, and semiconductor circuit board and method for manufacturing the same | Sugio Miyazawa, Yasunori Iwasaki, Akiyoshi Ide, Hirokazu Nakanishi | 2016-08-23 |
| 9390955 | Handle substrate and composite wafer for semiconductor device | Yasunori Iwasaki, Sugio Miyazawa, Akiyoshi Ide, Hirokazu Nakanishi | 2016-07-12 |
| 9046545 | Semiconductor device using a silicon wafer with a pattern arrangement | — | 2015-06-02 |