TE

Takashi Egawa

NI Ngk Insulators: 4 patents #658 of 2,083Top 35%
NE Nec: 2 patents #5,510 of 14,502Top 40%
GI Gs Yuasa International: 1 patents #283 of 491Top 60%
AC Advics Co.: 1 patents #370 of 686Top 55%
OC Oki Electric Industry Co.: 1 patents #1,459 of 2,807Top 55%
DC Dowa Electronics Materials Co.: 1 patents #148 of 241Top 65%
Overall (All Time): #445,852 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
D1054284 Packaging case 2024-12-17
8431271 Positive active material for lithium secondary battery and lithium secondary battery Yukiko Fujino, Yoshinobu Yasunaga, Akihiro Fujii, Yohei Shibata, Mariko Kohmoto +4 more 2013-04-30
8344356 Semiconductor material, method of making the same, and semiconductor device Ryo Sakamoto, Jo Shimizu, Tsuneo Ito 2013-01-01
7926268 Master cylinder 2011-04-19
7825417 Epitaxial wafers, method for manufacturing of epitaxial wafers, method of suppressing bowing of these epitaxial wafers and semiconductor multilayer structures using these epitaxial wafers Masahiro Sakai, Mitsuhiro Tanaka 2010-11-02
7479658 Epitaxial wafers, method for manufacturing of epitaxial wafers, method of suppressing bowing of these epitaxial wafers and semiconductor multilayer structures using these epitaxial wafers Masahiro Sakai, Mitsuhiro Tanaka 2009-01-20
7135347 Method for manufacturing nitride film including high-resistivity GaN layer and epitaxial substrate manufactured by the method Makoto Miyoshi, Masahiro Sakai, Mitsuhiro Tanaka, Hiroyasu Ishikawa 2006-11-14
6835965 Semiconductor light-emitting devices Mitsuhiro Tanaka, Tomohiko Shibata, Osamu Oda 2004-12-28
6697863 Method and packet-processing device for use in an active node included in an active network to allocate a sequence of packets received by the active node Koji Hino 2004-02-24
5745694 Network resource reservation with admission and link control functions separated for expandability and high-speed operation Makiko Yoshida, Hiroyuki Okazaki 1998-04-28
4713354 Method of heat treatment for reduction of dislocation density near III-V substrate surface Yoshiaki Sano 1987-12-15