Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6077365 | Beryllium-copper bonding material | Hiroshi Kawamura, Naoki Sakamoto | 2000-06-20 |
| 5958105 | Process for preparing metallic beryllium pebbles | Etsuo Ishitsuka, Hiroshi Kawamura, Naoki Sakamoto | 1999-09-28 |
| 5895533 | Beryllium-copper bonding material | Hiroshi Kawamura, Naoki Sakamoto | 1999-04-20 |