Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4894708 | LSI package having a multilayer ceramic substrate | — | 1990-01-16 |
| 4819131 | Integrated circuit package having coaxial pins | — | 1989-04-04 |
| 4744007 | High density LSI package for logic circuits | Junzo Umeta | 1988-05-10 |
| 4652970 | High density LSI package for logic circuits | Junzo Umeta | 1987-03-24 |
| 4612601 | Heat dissipative integrated circuit chip package | — | 1986-09-16 |