RY

Rieka Yoshino

NE Nec: 3 patents #4,195 of 14,502Top 30%
Overall (All Time): #1,628,130 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6063649 Device mounting a semiconductor element on a wiring substrate and manufacturing method thereof 2000-05-16
5994165 Method for mounting a semiconductor chip Kei Tanaka 1999-11-30
5959362 Device mounting a semiconductor element on a wiring substrate including an adhesive material having first and second adhesive components with different cure characteristics 1999-09-28