Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7579211 | Flip-chip semiconductor device utilizing an elongated tip bump | — | 2009-08-25 |
| 6975036 | Flip-chip semiconductor device utilizing an elongated tip bump | — | 2005-12-13 |
| 6919646 | Semiconductor device with contacting electrodes | — | 2005-07-19 |
| 6841420 | Semiconductor device and method of manufacturing the same | — | 2005-01-11 |
| 6538335 | Semiconductor apparatus and a semiconductor device mounting method | Toshiyasu Shimada | 2003-03-25 |
| 6344372 | Semiconductor device with reliable connection between projective electrode and conductive wire of the substrate | Takatoshi Suzuki | 2002-02-05 |
| 6311888 | Resin film and a method for connecting electronic parts by the use thereof | Yoshitsugu Funada | 2001-11-06 |
| 6214446 | Resin film and a method for connecting electronic parts by the use thereof | Yoshitsugu Funada | 2001-04-10 |
| 6197617 | Semiconductor device with high reliability of connection between projective electrode of semiconductor element and conductive wire of substrate and method of manufacturing the same | Takatoshi Suzuki | 2001-03-06 |