Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791195 | Semiconductor device and manufacturing method of the same | — | 2004-09-14 |
| 6515357 | Semiconductor package and semiconductor package fabrication method | — | 2003-02-04 |
| 6372549 | Semiconductor package and semiconductor package fabrication method | — | 2002-04-16 |
| 6173884 | Semiconductor device and equipment for manufacturing the same as well as method of fabricating the same | — | 2001-01-16 |
| 6046495 | Semiconductor device having a tab tape and a ground layer | — | 2000-04-04 |
| 5869887 | Semiconductor package fabricated by using automated bonding tape | — | 1999-02-09 |
| 5743459 | Method for fabricating semiconductor device with step of bonding lead frame leads to chip pads | — | 1998-04-28 |
| 5686757 | Film carrier tape for use in tape automated bonding | — | 1997-11-11 |
| 5662263 | Single point bonding method | — | 1997-09-02 |
| 5503321 | Bonding tool employed in ultrasonic compression bonding apparatus | — | 1996-04-02 |
| 5474957 | Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps | — | 1995-12-12 |
| 5350947 | Film carrier semiconductor device | Kouichi Takekawa | 1994-09-27 |