Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5426849 | Method of producing a polyimide multilayer wiring board | Shinichi Hasegawa, Hisashi Ishida | 1995-06-27 |
| 5321210 | Polyimide multilayer wiring board and method of producing same | Shinichi Hasegawa, Hisashi Ishida | 1994-06-14 |
| 5111003 | Multilayer wiring substrate | — | 1992-05-05 |
| 4710592 | Multilayer wiring substrate with engineering change pads | — | 1987-12-01 |