Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6564448 | Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it | Kikuo Oura | 2003-05-20 |
| 6523256 | Method of manufacturing a wiring board | Kikuo Oura | 2003-02-25 |
| 6492597 | Wiring substrate, multi-layered wiring substrate and method of fabricating those | Taro Hirai | 2002-12-10 |
| 6449835 | Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it | Kikuo Oura | 2002-09-17 |
| 6286207 | Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it | Kikuo Oura | 2001-09-11 |
| 4302600 | Process for the purification of an aqueous acrylamide solution | Jun Saitoh, Toshimi Nakagawa, Tadatoshi Honda, Takatoshi Mitsuishi, Hiroshi Itoh | 1981-11-24 |